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Safety Supervisors’ Communication Council (SSCC)
The purpose of this Standard is to standardize the specifications for 300 mm wafer coin-stack type shipping container used for test and packaging processes for wafers
本基準說明半導體製造設備之能源、電力及原料的節約概念。
SEMI MF1152-0305 (Reapproved 0211)
G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Revision:SEMI G9-89 - Inactive Safety Supervisors’ Communication Council (SSCC)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for the stamping manufacture of leadframes for plastic molded dual in line semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers and mold
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